Author:
Kuo Dong-Hau,Lai Chin-Chan,Su Te-Yeu
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. P. Chahal, R.R. Tummala, IEEE Transaction on Components, Packaging, and Manufacturing Technology B 21 (2) (1998) 184–193.
2. S. Bhattacharya, R.R. Tummala, P. Chahal, G. White, in: Proceedings of the International Symposium on Advanced Packaging Materials, 1997, pp. 68–70.
3. M.F. Yan, W.W. Rhodes, Ultrahigh dielectric capacitance in TiO2 ceramics, in: M.F. Yan, A.H. Heuer (Eds.), Additives and Interfaces in Electronic Ceramics, The American Ceramic Society, 1983.
4. Y.M. Chiang, D. Birnie III, W.D. Kingery, Physical Ceramics, John Wiley & Sons, Inc., New York, 1997, pp. 129–130.
5. D.H. Kuo, C.C. Chang, T.Y. Su, W.K. Wang, B.Y. Lin, Mater. Chem. Phys. 85 (2004) 201–206.
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