Optimization of electrophoretic deposition and thermal treatment of Cu–Mn spinel matrix for spinel/perovskite composite coating used as SOC metallic interconnect
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Published:2024-09
Issue:18
Volume:50
Page:34017-34026
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ISSN:0272-8842
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Container-title:Ceramics International
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language:en
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Short-container-title:Ceramics International
Author:
Mazur ŁukaszORCID,
Domaradzki KamilORCID,
Winiarski PawełORCID,
Zych ŁukaszORCID,
Brylewski TomaszORCID
Funder
Narodowe Centrum Nauki