Densification, microstructure, thermal and mechanical properties of Si3N4 ceramics: Effect of Y2Si4N6C and MgSiN2 content-Reference-Cited by-同舟云学术

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Densification, microstructure, thermal and mechanical properties of Si3N4 ceramics: Effect of Y2Si4N6C and MgSiN2 content

Published:2024-10 Issue:20 Volume:50 Page:38507-38513
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Liu Yun,Liu Ruixiang,Zheng Yuanhang,Zhao Jixue,Sui Tianyi,Li Xiaolei^ORCID,Lin Bin

Funder

National Natural Science Foundation of China

Natural Science Foundation of Tianjin Municipality

Publisher

Elsevier BV

Reference47 articles.

1. Silicon carbide as a platform for power electronics;Eddy;Science,2009

2. Present status and future prospect of widegap semiconductor high-power devices;Okumura;Jpn. J. Appl. Phys.,2006

3. Promising high-thermal-conductivity substrate material for high-power electronic device: silicon nitride ceramics;Hu;Rare Met.,2020

4. Fabrication of high thermal conductivity silicon nitride ceramics by pressureless sintering with MgO and Y2O3 as sintering additives;Lu;Ceram. Int.,2020

5. State of the art of high temperature power electronics;Buttay;Mat. Sci. Eng. B-Adv.,2011

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