Effects of Cu ion implantation on the microstructure, dielectric and impedance properties of SrTiO3 ceramics prepared by reduction-reoxidation method
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Published:2024-09
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ISSN:0272-8842
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Container-title:Ceramics International
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language:en
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Short-container-title:Ceramics International
Author:
Bai Wei,
Zhou YiORCID,
Xiao Menghang,
Xu LingfangORCID,
Xiao Haibo,
Tong Yang,
He Chuangchuang,
Pang Jinbiao,
Xie Qiang,
Yang Changping