Dynamic process of wet etching using BOE solutions to control the etch rate, roughness, and surface morphology of a Z-cut α-quartz wafer-Reference-Cited by-同舟云学术

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Dynamic process of wet etching using BOE solutions to control the etch rate, roughness, and surface morphology of a Z-cut α-quartz wafer

Published:2024-07 Issue:14 Volume:50 Page:25978-25987
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Xue Hong^ORCID,Zhang Zichao^ORCID,Ai Jiabin,Li Cun^ORCID,Li Bo^ORCID,Zhao Yulong,Wang Aihua

Funder

Fundamental Research Funds for the Central Universities

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference35 articles.

1. Fabrication of a quartz tuning-fork probe with a sharp tip for AFM systems;Hida;Sensor Actuator Phys.,2008

2. Fabrication of micro-lens array using quartz wet etching and polymer;Oh;Sensor Actuator Phys.,2010

3. High-stability quartz resonant accelerometer with micro-leverages;Han;J. Microelectromech. Syst.,2021

4. In-run navigation grade quartz MEMS-based IMU;Zotov,2020

5. The NG DIVA: a navigation grade differential inertial vibrating beam accelerometer;Le Traon,2018

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Etching Rate Analysis Model Based on Quartz Bond Angle Characteristics;Micromachines;2024-06-08

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