Free vibration and sound transmission properties of beetle elytron plate: structural parametric analysis
Author:
Funder
Southeast University
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Multidisciplinary
Reference44 articles.
1. In-plane compression behavior of hybrid honeycomb metastructures: theoretical and experimental studies;Xu;Aerosp. Sci. Technol.,2020
2. Research progress on curved plates in China: applications in architecture;Song;Appl. Sci.,2022
3. Model creation of strain rate–dependent energy absorption for paper honeycomb sandwich structure;Bai;J. Sandw. Struct. Mater.,2015
4. Natural frequency analysis of the honeycomb type steel open-web sandwich plate floor based on vibrate comfort requirement;Cai;Build. Sci.,2017
5. Clamping method and mechanical properties of aluminum honeycomb cylindrical curved plates under radial compression;Song;J. Sandw. Struct. Mater.,2022
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental Investigation on the Acoustic Insulation Properties of Filled Paper Honeycomb-Core Wallboards;Biomimetics;2024-09-01
2. Prediction of Sound Transmission Loss of Vehicle Floor System Based on 1D-Convolutional Neural Networks;Sound & Vibration;2024
3. Load-bearing behaviors of sandwich plates with non-uniformly distributed grid cores: static compression and bending;Journal of Materials Science;2023-11
4. Vibrational behavior of a 3D printed biomimetic dual‐core composite sandwich beam: An experimental and numerical study;Polymer Composites;2023-10-12
5. Free vibration properties of beetle elytron plate: Composite material, stacked structure and boundary conditions;Mechanics of Materials;2023-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3