Defect-free grinding of silicon nitride at high material removal rate-Reference-Cited by-同舟云学术

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Defect-free grinding of silicon nitride at high material removal rate

Published:2024-05 Issue:9 Volume:10 Page:e30232
ISSN:2405-8440
Container-title:Heliyon
language:en
Short-container-title:Heliyon

Author:

Seidelson Craig,Kannan Manigandan

Publisher

Elsevier BV

Reference17 articles.

1. Investigation of material removal mechanisms of laser-structured Si3N4 via single diamond grit scratching;Paknejad;Int. J. Adv. Manuf. Technol.,2023

2. Handbook of Ceramics Grinding and Polishing;Marinescu,2014

3. Size Effect for Specific Energy in Grinding of Silicon Nitride. T W. Hwang, Christopher J. Evans, S Malkin,1999

4. Scratch Behaviour of Bulk Silicon Nitride Ceramics 6, s.l. : micromachines;Xiao;Micromachines,2021

5. Stress-enhanced oxidation of silicon nitride ceramics;J. Am. Ceram. Soc.,1993

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