Effect of sintering temperature on the preparation of Cu–Ti3SiC2 metal matrix composite
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
General Materials Science
Reference39 articles.
1. Effect of arc discharge on wear rate of Cu-impregnated carbon strip in unlubricated sliding against Cu trolley under electric current;Kubo;Wear,1998
2. Wear of railway contact wires against current collector materials;He;Wear,1998
3. Synthesis and characterization of a remarkable ceramic: Ti3SiC2;Barsoum;Journal of the American Ceramic Society,1996
4. Current status in layered ternary carbide Ti3SiC2, a review;Zhang;Journal of Materials Science & Technology,2009
5. High temperature oxidation behavior of Ti3SiC2-based material in air;Sun;Acta Materialia,2001
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