Author:
Badgwell T.A.,Breedijk T.,Bushman S.G.,Butler S.W.,Chatterjee S.,Edgar T.F.,Toprac A.J.,Trachtenberg I.
Subject
Computer Science Applications,General Chemical Engineering
Reference238 articles.
1. The plasma etching of polysilicon with CF3Cl/Ar discharges: parametric modeling and impedance analysis;Allen;J. Electrochem. Soc.,1986
2. The plasma etching of polysilicon with CF3Cl/Ar discharges: Modeling of ion bombardment energy distributions;Allen;J. Electrochem. Soc.,1986
3. The plasma etching of polysilicon with CF3C1/Ar discharges: Modeling of etching rate and directionality;Allen;J. Electrochem. Soc.,1986
4. Modelling, optimization, and control of the selective plasma etching of silicon and silicon dioxide;Allred,1991
5. Etch tailoring through flexible end-point detection;Angell;SPIE Vo. 1392, 543 Advanced Techniques for Integrated Circuit Processing,1990
Cited by
37 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献