A simultaneous analysis of segregation and diffusion of impurities in the grain boundary of a bicrystal. Application to sulphur segregation and diffusion in nickel bicrystals
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference12 articles.
1. Grain Boundary Structure and Kinetics;Martin,1980
2. “Thin films” Interdiffusion and Reaction;Gupta,1978
3. Lateral self-diffusion and electromigration in thin metal films
4. Mesure de la segregation intergranulaire d'equilibre dans un bicristal par une methode non destructive
5. CXXXVIII. Concentration contours in grain boundary diffusion
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1. On interfacial velocities during abnormal grain growth at ultra-high driving forces;Journal of Materials Science;2008-10
2. Chapter 7 Study of phenomena occurring at solid/solid interfaces Investigation of interface diffusion and segregation by the radiotracer technique;Interface Science and Technology;2004
3. Ségrégation d'équilibre aux interfaces : systèmes modèles et matériaux;Le Journal de Physique IV;1999-04
4. A New Method for Grain Boundary Diffusion Coefficient Measurement;Defect and Diffusion Forum;1998-02
5. Diffusion of sulfur from the grain boundaries to the surface in polycrystalline nickel;Scripta Materialia;1996-11
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