The segregation of bismuth to grain boundaries in copper-bismuth alloys-Reference-Cited by-同舟云学术

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The segregation of bismuth to grain boundaries in copper-bismuth alloys

Published:1973-08 Issue:8 Volume:21 Page:1151-1156
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Powell B.D,Mykura H

Publisher

Elsevier BV

Subject

General Engineering

Reference13 articles.

1. Use of LEED Apparatus for the Detection and Identification of Surface Contaminants

Cited by 76 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hydrogen embrittlement and strain rate sensitivity of electrodeposited copper: part I – the effect of hydrogen content;npj Materials Degradation;2024-08-05

2. Atomic-resolution observations of silver segregation in a [111] tilt grain boundary in copper;Physical Review B;2023-04-20

3. Effect of Bi addition on precipitation and dissolution in Cu–9at% In and Cu–5at% Sb alloys;Journal of Thermal Analysis and Calorimetry;2019-06-12

4. Experimental Confirmation of Grain Boundary Magnetism in Fe–Si and Fe–Sn Alloys by TEM-EELS;MATERIALS TRANSACTIONS;2019-03-01

5. Effect of surface-active elements on the formation of solidification cracks;The Paton Welding Journal;2018-10-28

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