Studies of the first steps of thin film interdiffusion in the Al-Ni system-Reference-Cited by-同舟云学术

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Studies of the first steps of thin film interdiffusion in the Al-Ni system

Published:1989-09 Issue:9 Volume:37 Page:2305-2312
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Tarento R.J.,Blaise G.

Publisher

Elsevier BV

Subject

General Engineering

Reference28 articles.

1. La diffusion dans les solides;Adda,1966

2. SIMS II Conf.,1979

3. SIMS III Conf.,1982

4. Sputtering—Surface changes induced by ion bombardment

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1. Linear growth of reaction layer during in-situ TEM annealing of thin film Al/Ni diffusion couples;Journal of Alloys and Compounds;2022-11

2. Analysis of Splitting and Martensitic Transformation of AlNi Intermetallic Obtained by Transient Liquid Phase Bonding;Metallurgical and Materials Transactions B;2020-03-30

3. Bonding by Self-Propagating Reaction;Materials Research Foundations;2019-03-15

4. Characterization of Al–Ni intermetallics around 30–60at% Al for TLPB application;Calphad;2014-03

5. Formation of intermetallic compound layer in multi-laminated Ni–(TiB2/Al) composite sheets during annealing treatment;Micron;2013-02

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