High-temperature creep rate and dislocation structure in a dilute copper-aluminium alloy-Reference-Cited by-同舟云学术

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High-temperature creep rate and dislocation structure in a dilute copper-aluminium alloy

Published:1973-07 Issue:7 Volume:21 Page:887-895
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Hasegawa T,Karashima S,Ikeuchi Y

Publisher

Elsevier BV

Subject

General Engineering

Reference37 articles.

1. The back stress in high temperature deformation

2. Quantitative Relation Between Properties and Microstructure;Bird,1969

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