A comparative study of diffusion induced grain boundary migration, recrystallization and volume diffusion during the low temperature diffusion of Al into Cu and Au-Reference-Cited by-同舟云学术

A comparative study of diffusion induced grain boundary migration, recrystallization and volume diffusion during the low temperature diffusion of Al into Cu and Au

Published:1983-02 Issue:2 Volume:31 Page:285-291
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Den Broeder F.J.A.,Klerk M.,Vandenberg J.M.,Hamm R.A.

Publisher

Elsevier BV

Subject

General Engineering

Reference27 articles.

1. An in situ X-ray study of phase formation in CuAl thin film couples

2. A continuous x‐ray study of the interfacial reaction in Au–Al thin‐film couples

3. Constitution of Binary Alloys;Hansen,1958

4. Constitution of Binary Alloys;Hansen,1958

5. R�ntgenographische Untersuchung der L�slichkeit von Aluminium in Kupfer

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