Evidence for the surface diffusion mechanism of thermal grooving in copper-Reference-Cited by-同舟云学术

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Evidence for the surface diffusion mechanism of thermal grooving in copper

Published:1959-03 Issue:3 Volume:7 Page:224-226
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Gjostein N.A.,Rhines F.N.

Publisher

Elsevier BV

Subject

General Engineering

Reference8 articles.

1. ASM monograph;Hess;Metal Interfaces,1952

2. Theory of Thermal Grooving

3. J. E. Hilliard, Research to be published.

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Nanoscale copper oxide ring structure on an SrTiO3substrate;Philosophical Magazine;2003-10

4. Shape evolution by surface diffusion;Physical Review B;1997-10-15

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