Thermal analysis of cured halogenated epoxy resins based on bisphenol-C
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Organic Chemistry
Reference33 articles.
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4. Liquid-rubber-modified epoxy adhesives cured with dicyandiamide. I. Preparation and characterization
5. C.D. Dudgeon, US Patent 4,308,118, 1981.
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