Author:
Chang Hong-Da,Wu Bei-En,Chandra Sil Manik,Yang Zong-Hao,Chen Chih-Ming
Subject
Materials Chemistry,Physical and Theoretical Chemistry,Spectroscopy,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference53 articles.
1. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004
2. Copper on the Move-Where it Comes from, Where it Goes to;Ruhrberg,2006
3. Characterization of TMAH based cleaning solution for post Cu-CMP application;Venkatesh;Microelectron. Eng.,2013
4. M. Fisher, Alkaline solutions for post CMP cleaning processes, US Patent No. US20070225181 A1 (2006).
5. Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution;Manivannan;Microelectron. Eng.,2014
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