Temperature-aware computing

Author:

Koren Israel,Krishna C.M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,General Computer Science

Reference94 articles.

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2. A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages;Amin;Microelectronics Reliability,2009

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1. Enhancing dependability and energy efficiency of cyber-physical systems by dynamic actuator derating;Sustainable Computing: Informatics and Systems;2020-12

2. Exploiting the Benefits of High-Level Synthesis for Thermal-Aware VLSI Design;2019 IEEE 37th International Conference on Computer Design (ICCD);2019-11

3. End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2017-09

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5. Online Inertia-Based Temperature Estimation for Reliability Enhancement;Journal of Low Power Electronics;2016-09-01

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