Economic and embodied energy analysis of integrated circuit manufacturing processes

Author:

Nagapurkar Prashant,Das Sujit

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,General Computer Science

Reference42 articles.

1. Applied Materials 2015. July. http://www.appliedmaterials.com/nanochip/nanochip-fab-solutions/july-2015/trends-in-subfab-energy-consumption-and-emissions-control.

2. Argonne National Laboratry (ANL). 2021. Greenhouse gases, Regulated Emissions, and Energy use in Technologies Model ® (2021.Net). Accessed October 22, 2021. doi:10.11578/GREET-Net-2021/dc.20210903.1.

3. Babbitt, CW, H. Madaka, S. Althaf, B. Kasulaitis, and EG Ryen. 2019. “Material composition of consumer electronics.” December.

4. “Assessing ICT global emissions footprint: Trends to 2040 & recommendations.”;Belkhir;J. Clean. Prod.,2018

5. Boyd, S. 2009. PhD Thesis. Life-Cycle Assessment of Semiconductors. Berkeley: University of California. Accessed January 20, 2020. https://digitalassets.lib.berkeley.edu/etd/ucb/text/Boyd_berkeley_0028E_10192.pdf.

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