Pyrolysis kinetics of electronic packaging material in a nitrogen atmosphere
Author:
Publisher
Elsevier BV
Subject
Health, Toxicology and Mutagenesis,Pollution,Waste Management and Disposal,Environmental Chemistry,Environmental Engineering
Reference25 articles.
1. A. Harper, Electronic Packaging and Interconnection Handbook, McGraw-Hill, New York, 1991, Chapter 6.
2. H.Y. Chang, Y.T. Huang, M.S. Jing, K.L. Cheng, Japanese Patent JP 2000109650 (2000).
3. Epoxy resin analysis by Fourier transform mass spectrometry: a comparison of pyrolysis and laser ablation
4. Thermal degradation of epoxy/silica composites monitored via dynamic mechanical thermal analysis
5. Thermal oxidative degradation of an epoxy resin
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