Direct Electrodeposition of Cu-Ni-W Alloys for the Liners for Shaped Charges-Reference-Cited by-同舟云学术

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Direct Electrodeposition of Cu-Ni-W Alloys for the Liners for Shaped Charges

Published:2010-05 Issue:5 Volume:26 Page:429-432
ISSN:1005-0302
Container-title:Journal of Materials Science & Technology
language:en
Short-container-title:Journal of Materials Science & Technology

Author:

He Hanwei,Jia Shouya

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference18 articles.

1. F.N. Mandigo: United States Patent, No. 4958569, 1990.

2. B.C. Bourne and G. Kenneth: United States Patent, No. 7261036, 2007.

3. J.W. Reese, D.C. Betancourt and N.S. Terry: United States Patent, NO. 6634300, 2003.

4. K.J.P. Norman and W. Dan: United States Patent, No. 6012392, 2000.

5. M.S. Chawla: United States Patent, No. 5792977, 1998.

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