Electrochemical response of Ti joints vacuum brazed with TiCuNi, AgCu, and Ag fillers
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference52 articles.
1. Topology optimization to reduce the stress shielding effect for orthopedic applications [J];AL-TAMIMI;Procedia CIRP,2017
2. Microstructural evolution of infrared brazed CP-Ti using Ti–Cu–Ni brazes [J];CHANG;Journal of Materials Science & Technology,2011
3. Titanium-based biomaterials for preventing stress shielding between implant devices and bone [J];NIINOMI;International Journal of Biomaterials,2011
4. Mechanical properties and microstructures of cast Ti–Cu alloys [J];KIKUCHI;Dental Materials,2003
5. Joining titanium materials with tungsten inert gas welding, laser welding, and infrared brazing [J];WANG;The Journal of Prosthetic Dentistry,1995
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1. Microstructure, mechanical properties and corrosion behaviour of Ti6Al4V/Al2O3 joints brazed with TiCuNi filler;Welding in the World;2022-12-21
2. Electron Beam Brazing of Titanium and Stainless Steel Dissimilar Joints with Ag-Based Filler;Key Engineering Materials;2022-12-14
3. Diffusion bonding of Ti—6Al—4V titanium alloy powder and solid by hot isostatic pressing;Transactions of Nonferrous Metals Society of China;2022-11
4. Effects of TiZn3 and TiZn16 components on the microstructure and mechanical performance of Ti-6Al-4 V alloy joints formed via ultrasonic assisted brazing using pre-galvanized workpieces;Ultrasonics;2022-09
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