Influence of rapid solidification on Sn–8Zn–3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging-Reference-Cited by-同舟云学术

Influence of rapid solidification on Sn–8Zn–3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging

Published:2017-01 Issue:1 Volume:27 Page:234-240
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

ZHAO Guo-ji,WEN Guang-hua,SHENG Guang-min

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference23 articles.

1. Lead-free solders in microelectronics [J];ABTEW;Materials Science and Engineering R: Reports,2000

2. Sn–Zn low temperature solder [J];SUGANUMA;Journal of Materials Science: Materials in Electronics,2007

3. Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array [J];GARCIA;Materials Characterization,2010

4. Present status of Sn–Zn lead-free solders bearing alloying elements [J];LIU;Journal of Materials Science: Materials in Electronics,2015

5. A comparison of impression, indentation and impression-relaxation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders at room temperature [J];MAHMUDI;Journal of Materials Science: Materials in Electronics,2009

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