Corrosion characteristics of Sn-20Bi-xCu-yIn solder in 3.5% NaCl solution-Reference-Cited by-同舟云学术

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Corrosion characteristics of Sn-20Bi-xCu-yIn solder in 3.5% NaCl solution

Published:2023-06 Issue:6 Volume:33 Page:1827-1838
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

QI Da,YANG Wen-chao,JIANG Shi-wei,FU Yao-kun,SONG Qian-qian,ZHAN Yong-zhong

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference38 articles.

1. Fracture pattern evolution of SnAgCu–SnPb mixed solder joints at cryogenic temperature [J];WU;Transactions of Nonferrous Metals Society of China,2021

2. Effect of indium addition on the microstructural formation and soldered interfaces of Sn–2.5Bi–1Zn–0.3Ag lead-free solder [J];DONG;International Journal of Minerals, Metallurgy, and Materials,2012

3. Electrochemical corrosion behavior of Sn–0.7Cu solder alloy with the addition of bismuth and iron [J];JAFFERY;Journal of Alloys and Compounds,2019

4. The thermal property of lead-free Sn–8.55Zn–1Ag–XAl solder alloys and their wetting interaction with Cu [J];CHENG;Journal of Electronic Materials,2002

5. Effect of Sb addition on Bi–2.6Ag–0.1Cu solders for high-temperature applications [J];KIM;Journal of Alloys and Compounds,2014

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on preparation and properties of high-temperature-resistant (220 ℃) Bi-xSn coating on dissolvable magnesium alloys;Journal of Alloys and Compounds;2024-11

2. Electrochemical corrosion behavior of industrial pure zirconium in high Cl- containing solutions;International Journal of Electrochemical Science;2024-03

3. Effects of In and aging treatment on the microstructure, mechanical properties and electrochemical corrosion behavior of Sn 2Cu solder alloy;Materials Characterization;2024-03

4. Study on the preparation and properties of Sn–0.7Cu–xBi alloy;RSC Advances;2023

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