1. Transmission electron microscopy of focused ion beam induced damage at 50keV in Si;Albarede,1998
2. Combined tripod polishing and FIB method for preparing semiconductor plan view specimens;Anderson,1997
3. High resolution structure imaging of octahedral void defects in as-grown Czochralski silicon;Bender;Japanese Journal of Applied Physics, Part 2: Letters,1997
4. Focused ion beam milling and micromanipulation lift-out for site specific cross-section TEM specimen preparation;Giannuzzi,1997
5. Focused ion beam milling for site specific scanning and transmission electron microscopy of materials;Giannuzzi;Microscopy and Microanalysis,1997