Author:
Jiang Lelun,Ling Jintian,Jiang Linzhen,Tang Yong,Li Yan,Zhou Wei,Gao Jinwu
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province, China
New Teachers’ Fund for Doctor Stations, Ministry of Education, China
Subject
Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment
Reference28 articles.
1. Experimental investigation into the performance of heat pipe with micro grooves fabricated by extrusion–ploughing process;Tang;Energy Convers Manage,2010
2. Investigation into performance of a heat pipe with micro grooves fabricated by extrusion–ploughing process;Wang;Energy Convers Manage,2009
3. Heat pipe for cooling of electronic equipment;Chang;Energy Convers Manage,2008
4. Recent developments of lightweight, high performance heat pipes;Yang;Appl Therm Eng,2012
5. Wang JL, Catton I. Biporous heat pipes for high power electronic device cooling. In: Semiconductor thermal measurement and management seventeenth annual IEEE symposium, San Jose, CA; 2001. p. 211–8.
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