Author:
El-Genk Mohamed S.,Parker Jack L.
Subject
Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment
Reference50 articles.
1. Xu G, Guenin B, Vogel M. Extension of air cooling for high power processors. In: Proceedings 9th intersociety conference on thermal phenomena (Itherm-04), vol. 1, 2004. p. 186–93
2. Thermal challenges in next generation electronic systems summary of panel presentations and discussions;Garimella;IEEE Trans Comp Packing Technol,2002
3. Arvelo A, Toy H, Sikka K. Package cooling designs for a dual-chip electronic package with one high power chip. In: Proceedings 9th intersociety conference on thermal phenomena (Itherm-04), vol. 2, 2004. p. 23–3
4. An advanced multichip module (MCM) for high-performance UNIX servers;Knickerbocker;IBM J Res Dev,2002
5. Mudawar I. Assessment of high-heat flux thermal management schemes. In: Proceedings of fifth intersociety conference on thermal phenomena (Itherm-02), 2000. p. 1–20
Cited by
75 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献