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Experimental investigation on the thermal performance and optimization of heat sink with U-shape heat pipes

  • Published:2010-11 Issue:11 Volume:51 Page:2109-2116
  • ISSN:0196-8904
  • Container-title:Energy Conversion and Management
  • language:en
  • Short-container-title:Energy Conversion and Management

Author:

Liang Tian Shen,Hung Yew Mun

Publisher

Elsevier BV

Subject

Energy Engineering and Power Technology,Fuel Technology,Nuclear Energy and Engineering,Renewable Energy, Sustainability and the Environment

Reference15 articles.

1. Thermal frontiers in the design and packaging microelectronic equipment;Bar-Cohen;Mech Eng,1983

2. Active coolers based on copper-water LHPs for desktop PC;Pastukhov;Appl Therm Eng,2009

3. Steady state analysis of cooling electronic circuits using heat pipes;Legierski;IEEE Trans Comp Packag Technol,2001

4. Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes;Wang;Int Commun Heat Mass Transfer,2007

5. Heat pipe for cooling of electronic equipment;Chang;Energy Convers Manage,2008

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1. Thermal resistance analysis of micro heat pipes incorporated with carbon nanotubes nanocapillaries;International Journal of Heat and Mass Transfer;2023-12

2. EFFECT OF GEOMETRIC PARAMETERS ON THE HEAT TRANSFER PERFORMANCE OF COMPUTER CPU COOLERS;Proceeding of 8th Thermal and Fluids Engineering Conference (TFEC);2023

3. Experimental and Simulation Study of a U-Shaped Water-Cooled Sleeve Heat Pipe Radiator for High Heat Flux Density;2023

4. Heat pipes for computer cooling applications: A review;PROCEEDINGS OF THE 1ST INTERNATIONAL CONFERENCE ON FRONTIER OF DIGITAL TECHNOLOGY TOWARDS A SUSTAINABLE SOCIETY;2023

5. Heat Flow Management in Portable Electronic Devices;Engineering Optimization: Methods and Applications;2022-10-05
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