Thermal analysis of a nano-pore silicon-based substrate using a YAG phosphor supported COB packaged LED module-Reference-Cited by-同舟云学术

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Thermal analysis of a nano-pore silicon-based substrate using a YAG phosphor supported COB packaged LED module

Published:2014-12 Issue: Volume:86 Page:307-313
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Chuluunbaatar Z.,Wang C.,Kim E.S.,Kim N.Y.

Funder

National Research Foundation of Korea (NRF)

Korean government (MEST)

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference18 articles.

1. Thermal analysis of loop heat pipe used for high-power LED;Lu;Theor. Chim. Acta.,2009

2. Thermal performance of high brightness LED array package on PCB;Yung;Int. Commun. Heat Mass.,2010

3. Thermal analysis of power LED employing dual interface method and water flow as a cooling system;Anithambiga;Theor. Chim. Acta.,2011

4. Thermal investigation of LED lighting module;Choi;Microelectron. Reliab.,2012

5. Thermal measurements and analysis of low-cost high-power LED packages and their modules;Tsai;Microelectron. Reliab.,2012

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