1. M. Mukadam, J. Schake, P. Borgesen, K. Srihari, Effects of assembly process variables on voiding at a thermal interface, in: Proceedings of Thermal and Thermo-mechanical Phenomena in Electronic Systems Conference (ITHERM), Las Vegas, NV, USA, 2004, pp. 58–62.
2. Advanced fault isolation and failure analysis techniques for future packaging technologies;Pacheco;Intel Technology Journal,2005
3. An Introduction to the Principles of Medical Imaging;Guy,2005
4. Optical tomography in medical imaging;Arridge;Inverse Problems,1999
5. X-ray micro-tomography an attractive characterization technique in materials science;Salvo;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms,2003