Mechanisms of the thermal electromotive force, heating and cooling in semiconductor structures-Reference-Cited by-同舟云学术

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Mechanisms of the thermal electromotive force, heating and cooling in semiconductor structures

Published:2015-06 Issue: Volume:92 Page:44-49
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Titov O.Yu.,Velazquez-Perez J.E.,Gurevich Yu.G.

Funder

CONACYT-Mexico

Spanish Ministerio de Economía y Competitividad (MINECO)

FEDER

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference30 articles.

1. 11th Asia and South Pacific Design Automation Conference. – Yokohama (Japan);Banerjee,2006

2. Thermoelectric Materials, Phenomena, and Applications: A Bird's Eye View

3. Thermoelectrics: Basic Principles and New Materials Development;Nolas,2001

4. Semiconductor Thermoelements and Thermoelectric Cooling;Ioffe,1957

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