A novel ultra-thin vapor chamber with radial-gradient hierarchical wick for high-power electronics cooling-Reference-Cited by-同舟云学术

A novel ultra-thin vapor chamber with radial-gradient hierarchical wick for high-power electronics cooling

Published:2023-01 Issue: Volume:183 Page:107896
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Zhou Feng,Zhou Guohui,Zhou Jingzhi,Huai Xiulan,Jiang Yawen

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

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