Effect of silicon nanorod length on horizontal nanostructured plates in pool boiling heat transfer with water
Author:
Publisher
Elsevier BV
Subject
General Engineering,Condensed Matter Physics
Reference45 articles.
1. Optimization of microchannel geometry for direct chip cooling using single phase heat transfer;Upadhye,2004
2. Assessment of high-heat-flux thermal management schemes;Mudawar;IEEE T. Compon. Pack. T.,2001
3. Heat transfer characteristics of submerged jet impingement boiling of saturated FC-72;Cardenas;Int. J. Heat. Mass Transf.,2012
4. Heat transfer enhancement using Al2O3-water nanofluid for an electronic liquid cooling system;Nguyen;Appl. Therm. Eng.,2007
5. Enhancement of pool-boiling heat transfer using nanostructured surfaces on aluminum and Copper;Hendricks;Int. J. Heat. Mass Transf.,2010
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