Numerical simulation of three-dimensional transient cooling application on a portable electronic device using phase change material
Author:
Publisher
Elsevier BV
Subject
General Engineering,Condensed Matter Physics
Reference25 articles.
1. Melting in a side heated tall enclosure by a uniformly dissipating heat source;Pal;International Journal of Heat and Mass Transfer,2001
2. Thermal analysis of a phase change material based heat sink for cooling protruding electronic chips;Faraji;Journal of Thermal Science,2009
3. Analytical model for melting in a semi-infinite PCM storage with an internal fin;Lamberg;Heat and Mass Transfer,2003
4. Cyclic heat transfer in a novel storage unit of multiple phase change materials;Gong;Applied Thermal Engineering,1996
5. Solidification inside a sphere—an experimental study;Chan;International Communications in Heat and Mass Transfer,2006
Cited by 82 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Adjustable temperature and high thermal conductivity composite phase change material based on sodium acetate trihydrate–alanine/expanded graphite for thermal management of electronic devices;Chemical Engineering Journal;2024-10
2. A Finite Element Approach for Phase-Change Analysis of Paraffin;Journal of Polytechnic;2024-08-10
3. Design and performance evaluation of a novel electrohydrodynamically enhanced PCM heat sink;Journal of Energy Storage;2024-07
4. Structure Design and Heat Transfer Performance Analysis of a Novel Composite Phase Change Active Cooling Channel Wall for Hypersonic Aircraft;Micromachines;2024-05-06
5. Exploring thermal response in aluminum heat sinks with variable surface roughness for enhanced cooling;Thermal Science;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3