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Experimental and numerical study of micro-pin-fin heat sinks with variable density for increased temperature uniformity

  • Published:2018-10 Issue: Volume:132 Page:424-434
  • ISSN:1290-0729
  • Container-title:International Journal of Thermal Sciences
  • language:en
  • Short-container-title:International Journal of Thermal Sciences

Author:

Vilarrubí MontseORCID,Riera SaraORCID,Ibañez ManelORCID,Omri Mohamed,Laguna Gerard,Fréchette Luc,Barrau JérômeORCID

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference42 articles.

1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron. Device Lett.,1981

2. Heat sink optimization with application to microchannels;Knight;IEEE Trans. Components, Hybrids, Manuf. Technol.,1992

3. Developing convective heat transfer in deep rectangular microchannels;Harms;Int. J. Heat Fluid Flow,1999

4. Review and projections of integrated cooling systems for three-dimensional integrated circuits;Kandlikar;J. Electron. Packag.,2014

5. Extending the heat flux limit with enhanced microchannels in direct single-phase cooling of computer chips;Kandlikar,2005

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2. Thermal performance maximisation in a complex heat exchanger with solid and hollow cylindrical fins;International Communications in Heat and Mass Transfer;2024-03

3. Constructal Solid and Perforated Fin Installation in a Combined Microchannel Heat Sink for Maximum Heat Transfer;Journal of The Institution of Engineers (India): Series C;2024-01-03

4. Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems;Heat Transfer - Advances in Fundamentals and Applications [Working Title];2023-12-30

5. Thermal Performance Evaluation of Micro Pin–Fin Heat Exchangers: Part I—Geometrical Design Parameters Optimization;International Journal of Precision Engineering and Manufacturing;2023-10-30
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