Thermal performance of cold plates with novel pin-fins designed using Bézier curves
Author:
Funder
DSO National Laboratories - Singapore
Publisher
Elsevier BV
Subject
General Engineering,Condensed Matter Physics
Reference23 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. An experimental study of microchannel and micro-pin-fin based on-chip cooling systems with silicon-to-silicon direct bonding;Qiu;Sensors (Basel, Switzerland),2020
3. Heat transfer and pressure drop for short pin-fin arrays with pin-endwall fillet;Chyu;J. Heat Transfer,1990
4. Convective heat transfer of cubic fin arrays in a narrow channel;Chyu;J. Turbomach.,1998
5. Heat transfer, pressure loss and flow field measurements downstream of staggered two-row circular and elliptical pin fin arrays;Uzol;J. Heat Transfer,2005
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A novel center-hybrid pin-fin microchannel heat sink with embedded secondary microchannels for hotspot thermal management;International Journal of Thermal Sciences;2025-01
2. Design and optimization of a combi boiler heat exchanger: A CFD-based approach;Applied Thermal Engineering;2024-12
3. Heat load prediction in flow boiling using boiling-induced vibrations aided with machine learning;International Journal of Heat and Mass Transfer;2024-11
4. Experimental and numerical simulation study on the heat transfer effect of anti-icing wave-plate separators in marine air intake systems;Applied Thermal Engineering;2024-08
5. Experimental investigation of the thermal-hydraulic characteristics of liquid cooling heat sinks with novel pin fins;Case Studies in Thermal Engineering;2024-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3