Optimization analysis of heat dissipation performance of microchannel heat sinks with the addition of columnar inserts of spiral distribution
Author:
Publisher
Elsevier BV
Subject
General Engineering,Condensed Matter Physics
Reference45 articles.
1. Heat transfer and flow characteristics of Fe3O4-water nanofluids under magnetic excitation;Zhang;Int. J. Therm. Sci.,2021
2. Low-temperature two-phase microchannel cooling for high-heat-flux thermal management of defense electronics;Jaeseon;IEEE Trans. Compon. Packag. Technol.,2009
3. Optimization of thermal design of heat sinks: a review;Ahmed;Int. J. Heat Mass Tran.,2018
4. Evaluation of jet impingement, spray and microchannel chip cooling options for high heat flux removal;Kandlikar;Heat Tran. Eng.,2007
5. Effect of internal fins along with Hybrid Nano-Particles on solid process in star shape triplex Latent Heat Thermal Energy Storage System by numerical simulation;Hosseinzadeh;Renew. Energy,2020
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Multimodal transient topology optimization design of heat dissipation structure in electric aircraft power cabin;Applied Energy;2024-10
2. Multi-objective optimization of a microchannel heat sink combining cavities and longitudinal vortex generators based on CFD and NSGA-II genetic algorithm;International Journal of Heat and Mass Transfer;2024-03
3. Heat-transfer enhancement and optimization design of a roadway with typical angles using field synergy theory;Sustainable Energy & Fuels;2024
4. Heat transfer enhancement and temperature uniformity improvement of microchannel heat sinks with twisted blade-like fins;Case Studies in Thermal Engineering;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3