Author:
Braunschweig W.,Breibach J.,Gräßel D.,König St.,Kubicki Th.,Lübelsmeyer K.,Rente C.,Röper Ch.,Siedling R.,Syben O.,Tenbusch F.,Toporowski M.,Xiao W.J.
Subject
Nuclear and High Energy Physics,Atomic and Molecular Physics, and Optics
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1. Investigation of a bump bonding interconnect technology for GaAs pixel detectors;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2001-09