Development of a Sensor-Integrated “Intelligent” Grinding Wheel for In-Process Monitoring-Reference-Cited by-同舟云学术

Development of a Sensor-Integrated “Intelligent” Grinding Wheel for In-Process Monitoring

Published:2000 Issue:1 Volume:49 Page:231-234
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Varghese B.,Pathare S.,Gao R.,Guo C.,Malkin S.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference14 articles.

1. Grinding Mechanisms for Ceramics;Malkin;Annals of the CIRP,1996

2. Tool Condition Monitoring (TCM) - The Status of Research and Industrial Application;Byrne;Annals of the CIRP,1995

3. In Process Recognition of Cutting States, JSME International Journal;Dornfeld;Series C,1994

4. A Review of Tool Condition Monitoring Literature Data Base;Teti;Annals of the CIRP,1995

5. Ahrens, O., Binder, J., Böhm, C., and Brinksmeier, E., 1999, Development of Temperature and Force Sensors for In-process Monitoring of Grinding, Sensors ′99, Nümberg, P1.24.

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