Development of Highly Homogeneous Pellets Applying Electrophoretic Deposition of Ultrafine Abrasives for Nanometer Grinding
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference3 articles.
1. Nanometer Grinding Using Ultrafine Abrasive Pellets -Manufacture of Pellets Applying Electrophoretic Deposition -;Ikeno;Annals of the CIRP,1990
2. Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing;Ohmori;Annals of the CIRP,1990
3. Development of Chipping-Free Dicing Technology Applying Electrophoretic Deposition of Ultrafine Abrasives;Ikeno;Annals of the CIRP,1991
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1. Analysis and modeling of surface characteristics in electrophoretic deposition–assisted internal polishing of AISI 304 steel;The International Journal of Advanced Manufacturing Technology;2019-08-10
2. Vertical Spindle Grinding of Si and Granite with a New Abrasive Disk;Advances in Mechanical Engineering;2013-01
3. Polishing Technology;Manufacturing Engineering and Materials Processing;2006-11-20
4. Ceramics grinding under the condition of constant pressure;Journal of Materials Processing Technology;2002-10
5. Infeed Grinding of Silicon Wafers Applying Electrophoretic Deposition of Ultrafine Abrasives;CIRP Annals;1998
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