ELID Grinding and Polishing
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Elsevier
Reference31 articles.
1. Mirror surface grinding of silicon wafers with electrolytic in-process dressing;Ohmori;Ann CIRP,1990
2. Anodic metal matrix removal rate in electrolytic in-process dressing I: two dimensional modeling;Chen;J Appl Phys,2000
3. Anodic metal matrix removal rate in electrolytic in-process dressing II: protrusion effect and three-dimensional modeling;Chen;J Appl Phys,2000
4. Evaluation of surface characteristics of ground CVD-SiC using iron bond diamond wheels;Zhang;Precis Eng,2001
5. Grobsky K, Johnson D. ELID grinding of large optical (glass substrates). Report of Zygo Corporation; 1998.
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Probabilistic Approach for Modeling Electroerosion Removal of Grinding Wheel Bond;Procedia Engineering;2017
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