1. The electrodeposition of copper-lead alloys;FERGUSON;J. Electrochem. Soc.,1951
2. also Univ. Microfilms Publ. No. 2458, 201 pp.
3. J. M. BOOE, Electrodeposition of metals and alloys. U. S. Patent 2,545,566(1951).
4. also British Patent 578,389(1946).
5. Periodic current reversal in plating copper-lead alloys;HOVEY;J. Electrochem. Soc.,1955