Thermal properties and stability of boron-containing phenol-formaldehyde resin formed from paraformaldehyde-Reference-Cited by-同舟云学术

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Thermal properties and stability of boron-containing phenol-formaldehyde resin formed from paraformaldehyde

Published:2002-01 Issue:3 Volume:77 Page:495-501
ISSN:0141-3910
Container-title:Polymer Degradation and Stability
language:en
Short-container-title:Polymer Degradation and Stability

Author:

Liu Yanfang,Gao Jungang,Zhang Rongzhen

Publisher

Elsevier BV

Subject

Materials Chemistry,Polymers and Plastics,Mechanics of Materials,Condensed Matter Physics

Reference11 articles.

1. America Patash Chem Corp. British patent 957611, 1964.

2. Gao JG, Wang FL. Journal of Hebei University [special issue on chemistry], 1980:59 [in Chinese].

3. Thermal stability of boron-containing phenol formaldehyde resin

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