Improvement of electrical conductivity of Cu/Ag glue joints by discharge cleaning
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference21 articles.
1. Investigation of adsorption and absorption processes of hydrogen in plasma devices with ss or ti-coated walls
2. Electron cyclotron resonance discharge cleaning of JFT-2 Tokamak (Jaeri)
3. Rate of Production of Water Vapour in Low-Power, High-Repetition-Rate Discharge Cleaning
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