Diamond disc pad conditioning in chemical mechanical polishing-Reference-Cited by-同舟云学术

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Diamond disc pad conditioning in chemical mechanical polishing

Published:2016 Issue: Volume: Page:327-357
ISSN:
Container-title:Advances in Chemical Mechanical Planarization (CMP)
language:
Short-container-title:

Author:

Li Z.C.,Baisie E.A.,Zhang X.H.,Zhang Q.

Publisher

Elsevier

Reference78 articles.

1. CMP Market Outlook and New Technology – Dynamic Slurry Metrology;Shon-Roy,2012

2. CMP process modeling for improved process integration, development and control;Dornfeld;JSPS Jpn. Soc. Precis. Eng.,2010

3. Pad conditioning in chemical mechanical polishing;Hooper;J. Mat. Process. Technol.,2002

4. Chemical mechanical planarization for microelectronics applications;Zantye;Mater. Sci. Eng. Rep.,2004

5. Fundamental tribological and removal rate studies of inter-layer dielectric chemical mechanical planarization;Philipossian;Jpn. J. Appl. Phys,2003

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis on Pad Surface Roughness of Diamond Conditioning Process for CMP;ECS Journal of Solid State Science and Technology;2021-04-01

2. Study on quasi-orthogonal machining of elastomer pad by single-point diamond tool;The International Journal of Advanced Manufacturing Technology;2017-11-25

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