Advanced interconnect technology and reliability
Reference80 articles.
1. Edelstein, D.; Davis, C.; Clevenger, L.; Yoon, M.; Cowley, A.; Nogami, T.; Rathore, H.; Agarwala, B.; Arai, S.; Carbone, A.; Chanda, K.; Cohen, S.; Cote, W.; Cullinan, M.; Dalton, T.; Das, S.; Davis, P.; Demarest, J.; Dunn, D.; Dziobkowski, C.; Filippi, R.; Fitzsimmons, J.; Flaitz, P.; Gates, S.; Gill, J.; Grill, A.; Hawken, D.; Ida, K.; Klaus, D.; Klymko, N.; Lane, M.; Lane, S.; Lee, J.; Landers, W.; Li, W.-K.; Lin, Y.-H.; Liniger, E.; Liu, X.-H.; Madan, A.; Malhotra, S.; Martin, J.; Molis, S.; Muzzy, C.; Nguyen, D.; Nguyen, S.; Ono, M.; Parks, C.; Questad, D.; Restaino, D.; Sakamoto, A.; Shaw, T.; Shimooka, Y.; Simon, A.; Simonyi, E.; Tempest, S.; Van Kleeck, T.; Vogt, S.; Wang, Y.-Y.; Wille, W.; Wright, J.; Yang, C.-C.; Ivers, T. Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology. In Proceedings of the IEEE International Interconnect Technology Conference; IEEE; pp 214–216. 2. High-performance interconnects: an integration overview;Havemann;Proc. IEEE,2001 3. Interconnections, and Packaging for ULSI;Bakoglu,1990 4. Low dielectric constant materials for microelectronics;Maex;J. Appl. Phys.,2003 5. Low dielectric constant materials for ULSI interconnects;Morgen;Annu. Rev. Mater. Sci.,2000
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