Does orthodontic debonding lead to tooth sensitivity? Comparison of teeth with and without visible enamel microcracks
Author:
Publisher
Elsevier BV
Subject
Orthodontics
Reference29 articles.
1. Evaluation of anxiety level changes during the first three months of orthodontic treatment;Ersin;Korean J Orthod,2012
2. Pain intensity during the first 7 days following the application of light and heavy continuous forces;Ogura;Eur J Orthod,2009
3. A randomized controlled trial to assess the pain associated with the debond of orthodontic fixed appliances;Mangnall;J Orthod,2013
4. Prediction of prolonged pain experiences during orthodontic treatment;Bergius;Am J Orthod Dentofacial Orthop,2008
5. Pain experience during initial alignment with self-ligating and a conventional fixed orthodontic appliance system. A randomized controlled clinical trial;Fleming;Angle Orthod,2009
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