1. T. Hatano, T. Kuroda, M. Enoeda, M. Uchida, E. Ishitsuka, Y. Ohara, Qualification of Be and Be/Cu joints and mock-ups testing, ITER R&D Task Report, G16TT103FJ, T508, 2001
2. Interface structure of Be/DSCu diffusion bonding;Makino;JAERI-Conf.,1998
3. Solid state bonding of beryllium-copper for an ITER first wall application;Odegard;JAERI-Conf.,1998
4. Optimization of HIP bonding conditions for ITER shielding blanket/first wall made from austenitic stainless steel and dispersion strengthened copper alloy
5. H. Yamada et al., in: 17th IEEE/NPSS Symposium on Fusion Engineering, San Diego, USA, 7–11 October 1997