Microstructure and elemental distribution of multicrystal Ag/Cu interface in bimetallic strips with diffusion treatment
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference6 articles.
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1. On the Influence of Adhesive Stress-Separation Laws on Elastic Stress Singularities;Journal of Elasticity;2014-08-28
2. High-strength and high-conductive Cu/Ag multilayer produced by ARB;Journal of Alloys and Compounds;2010-09
3. Solid state joining of steel-Cu P/M preform tubes: use of interlayer and post joining heat treatments;Journal of Materials Science;2006-02
4. Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealing;Materials Science and Engineering: A;2004-04
5. Effects of rolling and sintering temperature on peel strength of bonding interfaces for Ag/Cu bimetallic strips;Materials Science and Technology;2003-06
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