Temporal variation in the impact of urban morphology on outdoor air temperature in the tropics: A campus case study
Author:
Funder
National University of Singapore
Publisher
Elsevier BV
Subject
Building and Construction,Geography, Planning and Development,Civil and Structural Engineering,Environmental Engineering
Reference53 articles.
1. World Urbanization Prospects: the 2018 Revision (ST/ESA/SER.A/420),2019
2. A historical review and assessment of urban heat island research in Singapore;Roth;Singapore J. Trop. Geogr.,2012
3. Heat island research in Europe: the state of the art;Santamouris;Adv. Build. Energy Res.,2007
4. Nocturnal urban heat island in Lisbon (Portugal): main features and modelling attempts;Alconforado;Theor. Appl. Climatol.,2006
5. The London heat island: results from summer time monitoring;Watkins;Build. Serv. Eng. Res. Technol.,2002
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